Defense Production Act (DPA) Title III Technology Market Research for 3D Microelectronics for Information Protection Project


The Title III program has identified 3D High Density Microelectronics for Information Protection as a technology area of interest for its future activities, and interested firms are encouraged to determine if they have information pertaining to this topic. For the purpose of this RFI, the Government is defining 3D High Density Microelectronics for Information Protection as three-dimensional (3D), ultra-high density microelectronics modules for use in Critical Program Information (CPI) protection applications. The focus shall be on product yield improvement and the expansion of production facilities to create an economically viable DoD and commercial supplier of 3D microelectronics modules incorporating Information Protection. Note: The program funding above ($100,000) is an estimate only and does not reflect any potential program funding which will be determined at a later date.

General information about this opportunity
Last Known Status
Deleted 03/06/2016 (Archived.)
Program Number
Federal Agency/Office
Agency: Department of Defense
Office: Department of the Air Force, Research Lab
Type(s) of Assistance Offered
Cooperative Agreement
Number of Awards Available
What is the process for applying and being award this assistance?
Other Assistance Considerations
Formula and Matching Requirements
This program has cost sharing or matching requirements.
Who do I contact about this opportunity?
Headquarters Office
Diana C. Aniton
Contracting/Agreements Officer
Phone 937-713-9897
E-mail Address
Financial Information


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